Beilstein J. Nanotechnol.2014,5, 1491–1500, doi:10.3762/bjnano.5.162
using a simple model the interface velocity in both the Cu and Au layers were estimated from the linear increase of the average composition and its value is about two orders of magnitude larger in Au (ca. 10−11 m/s) than in Cu (ca. 10−13 m/s).
Keywords: Cu/Au; grain boundary diffusion; nanofilmsof
intermetalliccompounds; secondary neutral mass spectrometry (SNMS); solid state reaction; Introduction
Solid-state reactions in nanostructured thin film systems are interesting and challenging not only from the point of view of pure fundamental research, but are also important for technological applications
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Figure 1:
Concentration profiles of Au(25nm)/Cu(50nm) system a) as deposited sample and annealed b) at 160 °C...